Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
3rd Generation Intel® Xeon® Scalable Processors Dual processor, 10nm technology CPU TDP up to 270W |
MEM |
16 x DIMM slots DDR4 memory supported only 1.2V modules: 3200/2933/2666 MHz |
DISK |
Front side: 4 x 2.5" Gen4 NVMe/SATA/SAS |
RAID |
Intel® SATA RAID 0/1/10/5 |
NIC |
1 x 10/100/1000 management LAN |
IO |
1 x OCP 3.0 slot 2 x USB 3.0 1 x VGA 1 x MLAN |
PCI-E |
6 x PCIe x16 (Gen4 x16) 1 x OCP 3.0 |
Power |
Dual 3000W 80 PLUS Platinum redundant power supply |
Size |
448mm x 86.8mm x 800mm |