Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM; |
Backplane |
NVMe/SATA/SAS |
Storage |
8x 3.5" SATA drive bays (2x 2.5" NVMe dedicated);1x PCIe 3.0 x 4 and SATA M-key, 2280, 22110;Optional 2x 2.5'' Gen4 NVMe drives at rear; |
RAID |
SATA3 (6Gbps) ,RAID 0/1/5/10 support; |
NIC |
2x 10GbE BaseT with Intel® X550,1 x RJ45 IPMI |
I/O |
USB 2.0、USB 3.0、VGA、COM |
PCI-E |
2 PCIe 4.0 x16 FHFL slot(s) 2 PCIe 4.0 x8 LP slot(s) |
Power |
650W Redundant Platinum Level power supplies |
Dimension |
2U Rackmount,437 x 89 x 647mm (17.2" x 3.5" x 25.5"); |