Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
16 DIMMs up to 6TB 3DS ECC DDR4-3200: LRDIMM/RDIMM/Intel® DCPMM; |
Backplane |
NVMe/SATA/SAS |
Storage |
12x 3.5" hot-swap NVMe/SATA/SAS drive bays (12x 3.5" NVMe hybrid);2x PCIe 3.0 x 4 and SATA M-key, 2280, 22110; |
RAID |
SATA3 (6Gbps) ,RAID 0/1/5/10 support; |
NIC |
Dual AIOM (OCP 3.0) slots with NCSI for networking,1 x RJ45 IPMI |
I/O |
USB 3.0、VGA、COM |
PCI-E |
4 PCIe 4.0 x8 FHHL slot(s) 2 PCIe 4.0 x16 FHHL slot(s) |
Power |
1200W Redundant Titanium Level power supplies |
Dimension |
2U Rackmount,437 x 89 x 647mm (17.2" x 3.5" x 25.5"); |