Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
8 DIMM slots;Up to 2TB: 8x 256 GB DRAM;Memory Type: 3200/2933/2666MHz ECC DDR4 RDIMM;LRDIMM |
Backplane |
SAS3/SATA3 |
Storage |
36x Hot-swap 3.5" SAS3/SATA3 drive bays (24 front + 12 rear), Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe/SATA (rear, optional); 2x Internal fixed bay support up to 4x 2.5" drive bays (optional); |
RAID |
SATA3 (6Gbps) , RAID 0, 1, 5, 10 support; |
NIC |
2x 10GbE BaseT with Intel® X550,1 x RJ45 IPMI |
I/O |
USB 3.0、 VGA |
PCI-E |
2 PCIe 4.0 x8 LP slot(s) 2 PCIe 4.0 x16 LP slot(s) |
Power |
1200W Redundant Power Supplies Titanium Level (96%) |
Dimension |
4U Rackmount,437 x 178 x 699mm (17.2" x 7" x 27.5"); |