Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Dual socket 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
16 DIMM slots;Up to 4TB: 16x 256 GB DRAM and 8x 512 GB PMem Memory Type: 3200MHz ECC DDR4 RDIMM;LRDIMM;DCPMM; |
Backplane |
SAS3/SATA3 |
Storage |
24 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Rear SATA Slots, 1x SATA/NVMe M.2 (form factor: 2280 and 22110) |
RAID |
SATA3 (6Gbps) ,Optional independent SAS RAID card with BBU; |
NIC |
2x 10GbE BaseT with Intel® X550,1 x RJ45 IPMI |
I/O |
USB 3.0、 VGA、COM、2x SuperDOM (Disk on Module) port |
PCI-E |
3 PCIe 4.0 x16 LP slot(s) 1 PCIe 4.0 x8 LP slot(s) |
Power |
1200W Redundant Power Supplies Titanium Level (96%); |
Dimension |
4U Rackmount,437 x 178 x 660mm (17.2" x 7" x 26"); |