Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
8 DIMMs; Supports 3DS DDR4-3200: RDIMM/LRDIMM/Intel® DCPMM; |
Backplane |
SAS3/SATA3 |
Storage |
12x Direct-attached hot-swap 3.5" SAS3/SATA3 drive bays, Onboard 1x NVMe/SATA M.2; 2x Hot-swap 2.5" NVMe/SATA (rear, optional); |
RAID |
SATA3 (6Gbps) ,RAID 0, 1, 5, 10 support; |
NIC |
2x 10GbE BaseT with Intel® X550,1 x RJ45 IPMI |
I/O |
USB 3.0、 VGA、COM、2x SuperDOM (Disk on Module) port |
PCI-E |
2 PCIe 4.0 x8 LP slot(s) 2 PCIe 4.0 x16 LP slot(s) |
Power |
800W Redundant Titanium Power Supply; |
Dimension |
2U Rackmount,437 x 89 x 650mm (17.2" x 3.5" x 25.6"); |