Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors; |
TDP |
270W |
MEM |
16 DIMM slotsUp to 4TB: 16x 256 GB DRAM;Memory Type: 3200MHz ECC DDR4 RDIMM,LRDIMM,DCPMM; |
Backplane |
SAS3/SATA3 |
Storage |
16x 3.5" hot-swap hybrid SATA/SAS drive bays (4 NVMe Hybrid Ports); 2 Rear SATA Slots; onboard 1 M.2 NVMe; |
RAID |
SATA3 (6Gbps) ,Optional independent SAS RAID card with BBU |
NIC |
2x 10GbE BaseT with Intel® X550,1 x RJ45 IPMI |
I/O |
USB 3.0、 VGA、COM、2x SuperDOM (Disk on Module) port |
PCI-E |
4 PCIe 4.0 x16 LP slot(s) 1 PCIe 4.0 x8 LP slot(s) |
Power |
1600W Redundant Power Supplies Titanium Level (96%); |
Dimension |
2U Rackmount,437 x 89 x 705mm (17.2" x 3.5" x 27.75") |