Product Center
Diversified product layout for AI, storage, general Purpose, etc.
CPU |
2 x Intel® Xeon® Scalable Processors. Dual Socket P (LGA 3647) supported CPU TDP support Up to 140W |
MEM |
16 x DDR4 DIMM slots 2933/2666/2400/2133MHz ECC DDR4 |
Backplane |
12Gbps SAS3/SATA |
DISK |
24~36 x hot-swap 2.5/3.5” |
RAID |
Optional independent SAS RAID card with BBU |
NIC |
Dual LAN with 10GBase-T |
I/O |
USB 2.0、 USB 3.0、VGA、COM |
PCI-E |
4 * PCI-E 3.0 x16; 2 * PCI-E 3.0 x8 1 * M.2( 2260/80/110) |
Power |
1200W 1+1 Redundant Power Supplies |
Size |
24 drive bays 660mm (Depth) x 437mm (Width) x 178mm (Height) 36 drive bays 699mm (Depth) x 437mm (Width) x 178mm (Height) |